TC1-10G Chip Quik Heat Sink Thermal Compound / Grease

Chip Quik TC1-10G Heat Sink Thermal Compound / Grease, High Density 10g Syringe 5cc.

High Density Thermal Paste. White, non-curing and non-flowing thermally conductive heat sink compound. Heavily filled with heat-conductive metal oxide. Provides high thermal conductivity, low bleed and high temperature stability. Electrically insulating (2 x 10^15 ohm-cm).

Viscosity: 542,000 cP (542,000 mPas)
Density: 2.1g/cc
Bleed: 0.23%
Thermal Conductivity: 0.67 W/mK
Thermal Resistance: 0.16 C*cm2/W
Electrical Volume Resistivity: 2 x 10^15 ohm-cm
Dielectric Strength: 8.27 MV/m (210V/mil)
Evaporation: 0.38%
Operating Temperature (Continuous): -40 to 150C (-40 to 302F)
Operating Temperature (Peak): 200C (392F)
Operating Life: >8 years *dependent on several factors, test in application to ensure suitability
Size: 10g Syringe (5cc)

Storage and Handling
Store refrigerated or at room temperature 3-25C (37-77F). Allow 4 hours for thermal paste to reach an application temperature of 20-25C (68-77F) before use.

Shelf Life
>60 months

Stencil Life
>7 days @ 20-70% RH 22-28C (72-82F)

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.